SM - 001 is a three-in-one intelligent device for solder paste storage, temperature return and stirring, which can be intelligently connected with IPM / MES. Internal integration of refrigeration system, temperature return system, stirring system and mechanical arm can automatically record data and realize the whole life cycle management of solder paste in intelligent factories. According to relevant standards, the cold storage temperature of solder paste is 1 - 10' c, so when the solder paste is taken out from the cold box, the temperature is much lower than room temperature. If the cap is opened without " rewarming", water vapor in the air will easily condense and adhere to the tin paste. when passing through the reflow oven ( the temperature exceeds 200 ℃ ), the water will evaporate quickly due to strong heat, causing " tin explosion" and even damaging the components. The correct rewarming method is: without opening the bottle cap, place it at room temperature to thaw naturally, and the rewarming time is over. 4 hours ( Note: ① Do not open the bottle cap without adequate " rewarming";  ( 2 ) Do not shorten the " warm - back" time by heating ) ISM - OOI has a built-in intelligent mechanical arm, which can automatically transfer solder paste from the cold storage area to the temperature return area, and automatically transfer solder paste to the solder paste stirring area for stirring after the temperature return, and automatically send solder paste to the exit position after the stirring is completed. Intelligent software can accurately control the usage time of solder paste / red glue in each can, and can interact with MES, ERP, WMS and other software of Gong J through XML