• Batch type Tube Furnace • Diffusion, LPCVD and Oxidation 4 • Independent Tubes • 200 wafers per tube • Compatible up to 200mm • Best in-class Uniformity • Automatic Loading
• Batch type Tube Furnace Diffusion, • Diffusion, LPCVD and Oxidation • 1 to 4 Independent Tubes • 50 wafers per tube • Ideal for Process Engineering • Tiny Footprint • Manual Loading
High-end products in semiconductors like WAFER, MEMS and MRAM. Product range started with manual wet stations for R&D, semi-automated systems and up to fully automated tools for the chemical surface treatment like cleaning, etching and drying. *Manual Wet Process Stations *Semi- and Fully Automated Wet Process Stations *Quartztube- and Part-Cleaning Stations *Total Metal Free Working Stations *Special Customer Specified Units *Chemical Supply Systems (pump or pressure systems)
ROTARIS ultra-high vacuum sputter deposition system
The ROTARIS ultra-high vacuum system is a modular platform for fast, precise and fully automated thin-film sputter deposition. The ROTARIS is a bridge system for 200 mm and 300 mm wafer processing. Its main deposition chamber RSM (Rotating-Substrate-Module) can house up to 12 physical vapor deposition (PVD) cathodes with a target diameter of 100 mm. The ROTARIS design provides in particular a rotating substrate deposition technology with the additional capability to tilt the substrate. Additional features for R&D are “Co-sputtering” with up to four cathodes, DC-, pulsed DC-, RF-sputtering, wafer heating, and an in-situ aligning magnetic field. The installation of an ion source as alternative equipment allows for surface treatment and smoothing, ion milling and side wall cleaning. Four additional different process modules are available to configure a ROTARIS system according to customer needs to cover their challenging R&D applications. These modules include industry proven modules like the Oxidation-Process-Module (OPM), Pre-Clean-Module (PCM), Combi-Process-Module (CPM) and Static-PVD-Module (sPVD-M).
· 200mm and 300mm wafer handling · Wafer transfer, sorting, split, merge, invert, randomized, compress wafer-lots, packing / unpacking, etc. · Wafer Carriers: FOUP / FOSB, SMIF Pod, 8-inch wafer with adapter in FOUP, Coin Stacked Box and custom-made wafer carriers. · Wafer carrier identification (RFID tag / barcode label) · 13 & 25 slots cassette capability · SMART wafer map and wafer cross slot detection · Bernoulli thin wafer handling capability · User-friendly windows interface · Wafer backside / edge inspection · SEMI, CE compliant · SECS / GEM compliance
· Up to 300mm wafer · Manual Wafer Mounter · Manual Tape Feeding · UV Tape Capability · Auto Linear Tape Rewinding · Manual Tape Cutting · Manual Waste Tape Removal · Manual Wafer & Frame Loading · Manual Mounted Wafer Unloading · Contact or Contactless Chuck · Quick Conversion
*Handle both Coin Stacked Box and Wafer Cassette *Wafer Box and Cassette Wafer Mapping / Scanning *Wafer "Cross Slot" Detection *Automatic Pick Wafer from Coin Stacked Box *Advanced 4-axis Robot Arm, included Motorized Flipper *Vision System Wafer Alignment *Smart Wafer ID Reader *SEC-GEMS Capability
FOSB & FOUP Capability *Vacuum Fork Arm or Beroulli Wafer Arm (Option) *Vision Wafer Alignment *OCR Wafer ID Reader (Option) *Macro Wafer Back Inspection *Integrated to Microscope For Inspection (Option) *Wafer Shipping Box Capability (Option)
Headquarters of Harvest Electronic Technology Co., Ltd in Beijing
