In the field of electrical equipment production, many customers use manual methods to remove gold and tin from components. For the micro-pitch IC pins, it is difficult to ensure consistency, coplanarity and tin-free pins, as a result, the machine identifying and throwing materials According to different devices and tin lining processes, we have listed the following equipment for tinning machines. Longmen tinning machine : Tin lining process for DIP and SOP components instead of electroplating process. Four - axis tin machine: Automatic handling of surface mount components ≥0.3mm pitch non-gold pin chip. Six - axis tin machine: Automatic handling of surface mount components, ≥0.3mm pitch gold pin chip. High speed tin machine: High - speed processing of axial components such as color ring resistors and diodes.
The " Intelligent Electrical Equipment Overall Solution" is Yufengkai's industry exploration and practice of " China 2025 Intelligent Manufacturing". Yufengkai Electronics integrates the project implementation experience of many enterprises, combines with many well-known international manufacturers and strategic partners to assist customers in the field of electrical equipment to realize interconnection of production management information, product batch information, raw material information, equipment operation status, environmental monitoring and energy management, automatic interaction between intelligent storage equipment and robots, unmanned warehouse management, and truly realize factory visualization, intelligence, digitalization, lean production, intelligent manufacturing and intelligent production management.
NP - 600 is an intelligent steel network storage device that automatically interacts with IPM / MES. After receiving the production instruction, the equipment will automatically release the steel mesh of the corresponding product. When storing and returning, it can be directly scanned and stored. In the aspect of steel mesh tension detection, the equipment can be interconnected with IPM / MES to automatically record the service parameters of the steel mesh for monitoring the service life of the steel mesh.
In the specific field of electrical equipment production, most of the components are screened bulk materials. SM 902 is an aerospace level chip mounter, which can mount various chip components, BGA, QFP chips, etc. with high efficiency, high precision and 100 % accuracy. In the field of micro - assembly, the bare chip can be accurately mounted through a 25x image module and a special suction nozzle. It can automatically generate mounting programs, automatically feed materials, automatically position mounting positions, have voice modules and electrical testing functions, and realize intelligent interconnection
Excellent uniformity by the center drive substrate rotation system. Shortened coating tact time achieved by higher performance in pumping and heating. Optical monitor, DC ion source, and Resistance heater evaporation source can be optionally installed.
OTFC series, based on the ion-assisted technology, are the most suitable coating system for producing AR coatings and optical filters such as edge filters, band pass filters etc. • Chamber size: φ 600mm-φ1800mm • 60-point optical thickness monitor. • RF ion source achieving uniformed, larger ion beam distribution over a larger area at high ion current density. • Over 100 layers can be deposited by 2 EB guns and multi-point crucible hearth or annular hearth. • Auto-deposition control system for fully automated process. • Center-driving or planetary substrate dome is selectable. • Diffusion pumps plus Polycold or Cryo- pumps.