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Gener series system Suitable for mass production of AR coating

Excellent uniformity by the center drive substrate rotation system. Shortened coating tact time achieved by higher performance in pumping and heating. Optical monitor, DC ion source, and Resistance heater evaporation source can be optionally installed.

OTFC series system

OTFC series, based on the ion-assisted technology, are the most suitable coating system for producing AR coatings and optical filters such as edge filters, band pass filters etc.   •     Chamber size: φ 600mm-φ1800mm •     60-point optical thickness monitor. •     RF ion source achieving uniformed, larger ion beam distribution over a larger area at high ion current density. •     Over 100 layers can be deposited by 2 EB guns and multi-point crucible hearth or annular hearth. •     Auto-deposition control system for fully automated process. •     Center-driving or planetary substrate dome is selectable. •     Diffusion pumps plus Polycold or Cryo- pumps.

MEMSLAB PECVD R&D Platform

•     Direct Plasma, Low RF •     Pin Mark Free, Color Uniform •     Horizontal Wafer Process •     Up to 25 wafers per batch •     Compatible up to 200mm •     In-situ Cleaning •     SiN, SiON, a:Si, SiC, SiCxNy

HTR-SERIES Production Furnace

• Batch type Tube Furnace • Diffusion, LPCVD and Oxidation 4 • Independent Tubes • 200 wafers per tube • Compatible up to 200mm • Best in-class Uniformity • Automatic Loading

TUBESTAR R&D Furnace Platform

•     Batch type Tube Furnace Diffusion, •     Diffusion, LPCVD and Oxidation •     1 to 4 Independent Tubes •     50 wafers per tube •     Ideal for Process Engineering •     Tiny Footprint •     Manual Loading

Wet Chemical process

High-end products in semiconductors like WAFER, MEMS and MRAM. Product range started with manual wet stations for R&D, semi-automated systems and up to fully automated tools for the chemical surface treatment like cleaning, etching and drying. *Manual Wet Process Stations *Semi- and Fully Automated Wet Process Stations *Quartztube- and Part-Cleaning Stations *Total Metal Free Working Stations *Special Customer Specified Units *Chemical Supply Systems (pump or pressure systems)

ROTARIS ultra-high vacuum sputter deposition system

The ROTARIS ultra-high vacuum system is a modular platform for fast, precise and fully automated thin-film sputter deposition. The ROTARIS is a bridge system for 200 mm and 300 mm wafer processing. Its main deposition chamber RSM (Rotating-Substrate-Module) can house up to 12 physical vapor deposition (PVD) cathodes with a target diameter of 100 mm. The ROTARIS design provides in particular a rotating substrate deposition technology with the additional capability to tilt the substrate. Additional features for R&D are “Co-sputtering” with up to four cathodes, DC-, pulsed DC-, RF-sputtering, wafer heating, and an in-situ aligning magnetic field. The installation of an ion source as alternative equipment allows for surface treatment and smoothing, ion milling and side wall cleaning. Four additional different process modules are available to configure a ROTARIS system according to customer needs to cover their challenging R&D applications. These modules include industry proven modules like the Oxidation-Process-Module (OPM), Pre-Clean-Module (PCM), Combi-Process-Module (CPM) and Static-PVD-Module (sPVD-M).

Automatic Wafer Sorter

· 200mm and 300mm wafer handling · Wafer transfer, sorting, split, merge, invert, randomized, compress wafer-lots, packing / unpacking, etc. · Wafer Carriers: FOUP / FOSB, SMIF Pod, 8-inch wafer with adapter in FOUP, Coin Stacked Box and custom-made wafer carriers. · Wafer carrier identification (RFID tag / barcode label) · 13 & 25 slots cassette capability · SMART wafer map and wafer cross slot detection · Bernoulli thin wafer handling capability · User-friendly windows interface · Wafer backside / edge inspection · SEMI, CE compliant · SECS / GEM compliance

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